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金秋入职季!这些高需求方向火热来袭
·关于瑞能半导体·
作为全球功率半导体行业的佼佼者,瑞能半导体已经走过了逾 50 年的辉煌历程。瑞能始终专注于研发行业领先、广泛且深入的功率半导体产品组合,公司主要产品主要包括碳化硅器件,可控硅整流器和晶闸管,快恢二极管,TVS,ESD,IGBT, 模块等。
产品广泛应用于以家电为代表的消费电子、以通信电源为代表的工业制造、新能源及汽车等领域。瑞能始终以优化客户体验,提升运营效率,强化核心技术为目标,推动全球智能制造行业的向前发展!
愿景VISION
成为全球领先的功率半导体中国供应商。
Become the leading China-based global Power Semiconductor supplier.
使命MISSION
我们通过提供可靠的,创新的和广泛的功率半导体产品组合,并凭借针对应用优化实现的高性价比,使得我们的客户在终端应用中实现最佳效率。
We enable our customers to achieve best-in-class efficiencies in their applications by providing a broad portfolio of highly reliable, cost-effective, and innovative power semiconductor devices.
职位速览
职位速览
工作地:上海
Location:Shanghai
研发工程师 – MOSFET/FRD/ESD
岗位职责:
■跟踪市场的需求并完成MOSFET/FRD/ESD 等芯片和产品的开发;
■参与制定产品的开发计划,负责器件的仿真和版图设计;
■和FAB 讨论确定工艺流程,并制定功率器件流片规划和分组条件;
■参与产品的设计文件的制定,包括工艺规范,封装规范和测试规范等。
任职资格 :
■电子工程,微电子,半导体或者物理等相关专业本科毕业,熟悉半导体制造工艺,具有硕士研究生学历以上者优先;
■具有三年以上产品开发设计经验;熟悉一种以下产品(MOSFET/FRD/ESD)开发流程;
■熟悉半导体封装和测试,了解功率器件的电气参数和动静态参数测试方法。
研发工程师 – IGBT
岗位职责:
■参与IGBT 芯片设计开发;
■负责IGBT 芯片的器件仿真,版图设计,流程拟定与优化;
■参与制定并实施产品开发计划,确保开发顺利完成;
■参与IGBT 产品相关设计文件,工艺文件,封装及测试文件的制定;
■晶圆厂,封装厂沟通协调。
任职资格:
■微电子或相关专业硕士及以上研究生,有相关功率半导体开发经验佳;
■掌握TCAD 工具,如Sentaurus,Silvaco,Cadence;
■熟悉Sic器件原理和设计方法;
■熟悉半导体器件制造过程和方法;
■熟悉IGBT 电气参数及测试方法;
■了解DOE,FMEA,FA 相关知识和应用。
研发工程师 – SiC
岗位职责:
■参与制定并实施SiC产品开发计划,确保开发顺利完成;
■参与SiC产品相关技术文件,封装及测试文件的制定;
■负责与封装厂沟通协调。
任职资格:
■微电子或相关专业本科及以上研究生,有相关功率半导体开发经验佳;
■熟悉功率器件原理;
■熟悉半导体器件制造过程和方法;
■熟悉功率器件电气参数及测试方法;
■了解DOE,FMEA,FA 相关知识和应用。
应用工程师(Diode or MOSFET)
岗位职责:
■分析客户端相关的应用需求,与产品经理一起参与瑞能新产品的参数与规格的定义;
■跟踪研究相关产品应用的发展趋势,包括通信电源,车载电源,EV charger,光伏逆变器等相关领域;
■为终端客户提供技术支持,并帮助客户解决新产品导入过程遇到的问题;
■为公司销售部同事,代理商和终端客户提供产品产品方面的培训,帮助客户进行更优化的系统级设计。
任职资格:
■本科及以上学历,电气工程,自动化,电力电子与电力传动相关专业;
■3-5年的电源变换设计经验,包括开关电源,消费电子,光伏逆变器,车载DCDC,OBC,UPS等相关领域;
■熟练掌握相关的专业软件工具,包括:Matlab/Simulink, Mathcad, Simplis, Protel, Candence等;
■具备在功率半导体原厂相应应用支持背景的尤佳。
Senior Development Engineer
(Thyristor/FRD/Schottky/TVS/ESD/ MOSFET)
Main Purpose of the Role:
■Development Engineers are responsible for carrying out new product development projects assigned to them by the Product Development Manager, developing and bringing to market new products as required by customers.
■Through a good understanding of semiconductor physics and state-of-the-art technology used in the industry, generate ideas for new projects and improvements to product design.
Requirements:
■Have a good educational and employment background in Electronics and Semiconductor Industry.
■Have good technical knowledge of our Bipolar Products, their design and operating principles as well as how they are used in a typical application.
Senior Development Engineer
(Product engineer)
Key Areas of Accountability:
■Link wafer FAB and Assembly factory, cooperate with package team to finish new product assembly, manage assembly engineering sample build schedule and analysis final test data.
■Maintain the product release process, such as BOM, test spec and yield analysis.
■Electrical characterization of power devices, such as I-V, C-V and double pulse test.
Requirements:
■Education Background: Bachelor’s degree in electrical engineering, Microelectronics, Semiconductor device physics or related area, Master is preferred.
■Minimum 3 years working experience in Semiconductor final test area or new product development.
■Solid knowledge of semiconductor package is preferred.
Product Marketing Manager (IGBT)
Main Purpose of the Roles:
■The Product Marketing is the interaction window between company internal and business relevant partners external. He/She will have the opportunity to work with the talented team to manage IGBT product portfolio as well as to take the role of product/brand value proposition and other market relevant activities.
■Participate in product definition
■Responsible for product portfolio and life cycle management
■Lead market strategy conception and deployment
■Drive customer penetration and promotion
■Mange general market activities
Requirements:
■At least Bachelor degree of engineering or business
■Proven market expansion successful experience or rich theory of marketing
■Insight of power semiconductor market is a plus
■Strong market sense and high degree of creativity
■Ability to make logical and fast decisions to capture the dynamic opportunity in the complicated business environment
■Excellent written, verbal communication and presentation skills
■Ability to travel ~40% of the time
Application Engineer SIC/IGBT
Key Areas of Accountability:
■Perform various tests of power semiconductor devices such as IGBT, FRD in discrete or module package to quantify their performances.
■Provide technical support to customers, FAEs, and Sales to win the business.
■Design, build, and test demo/evaluation boards.
■Evaluate new products and competition parts in application environments.
■Perform electrical & thermal simulation to identify product performance.
■Create application notes and technical articles to promote IGBT products.
■Collaborate with design engineers, device engineers, and package engineers.
■Actively participate in creating new product ideas with other members.
■Train FAEs, Sales, Disty so that they can skillfully promote IGBT products.
Requirements:
■At least Bachelor of Science degree plus relevant experience in power electronics.
■Experience in at least one of the following areas: Solar Inverter, UPS, EV charging pole, motor drive.
■Knowledge in power semiconductor devices.
■Ability to make logical decisions and enjoy solving problems.
■An active team player, and ability to work in a fast-paced team environment
■Ability to travel ~20% of the time.
■Basic English communication skills.
Process Integration Engineer (SIC)
Key Areas of Accountability:
■Responsible for the timely delivery of tasks to allow the completion of projects to the timelines defined in the overall Platform and new product introduction plans.
■Report regularly to relevant stakeholders on progress and results.
■Develop and maintain appropriate levels of expertise in associated areas.
■Provide technical support and expertise on various projects ranging from Platform development to new product introduction.
■Technical input to design rules.
■Lead process development projects.
■The engineer will define his own projects as well as undertake projects assigned to them.
■The engineer will then be responsible for detailed planning of experiment details to investigate and develop new processes and process modules to support current and future platform/product development activities. Execution of these experiments and analysis of their results.
■Progress is reported regularly to the stakeholders in R & D as required. At the end of the project, and at suitable intervals for longer projects, formal written reports to summarize project work should be produced.
Requirements:
■Bachelor or above degree, Electrical or Electronic Engineering/Physics degree (other science degrees might be considered).
■3 years above SiC Semiconductor’s fab experience. Process or Product oriented role in a Wafer Fab for a minimum of 3 years. Familiarity with Discrete Bipolar products would be a distinct advantage.
■Able to design, carry out and analyze process experiments carefully.
■Good English communication skills (reading, speaking, writing).
■Good present skills and team working skills.
■Proven ability to lead successful projects.
Order FulfillmentPlanner
Key Areas of Accountability:
■Fulfil customer order requirement.
■Diffusion plan 2 (Front-end), Back-end call off (PO) management.
■Capacity analysis, Safety stock analysis and management.
■Pull in /push out management to achieve sales target.
■Inventory review (non/slow/mover) and adjust safety stock.
■new Ramp-up Project inventory management.
■CLIP & RLIP tracking & improvement.
■EOL product inventory management.
Requirements:
■Be proactive, patient, hard-working, obliging, strong logic analysis
■Domestic import and export experience isdesirable.
■Competence on problem solving
■Capability to work out proposal or solution when encounter the issue.
■Familiar with SAP environment, excellent in Excel, PowerPoint and data analysis.
■Easy-going and well communication skill.
■5 years related working experience, prefer in Semiconductor Industry.
■Import & Export experience preferred
■Fluent English, Mandarin.
Education Requirements:
■Colleague degree above.
■Logistic, Planning or supply chain management is preferred.
工作地:上海金山
Location:Shanghai Jinshan
前道封装设备技术员
岗位职责:
■主要负责DB/WB设备的正常运作,包括日常维护、保养及异常处理,确保产能产出及良率的达成;
■能够独立处理DB/WB设备至少一种机台常见故障,确保产线设备正常运作;
■能够按作业指导书要求,熟练进行产品的转换,并达到生产要求;
■协助操作员做好关键设备日常点检,严格控制设备运行状况质量;
■协助工程师完成封装样品调试及加工;
■适应公司的倒班模式,遵守产线工艺和劳动纪律,服从主管调度,共同完成当班生产任务;
任职资格:
■有一定的设备维护保养经验;
■具有团队合作精神,较强的组织、协调和沟通能力。
后道封装设备技术员
岗位职责:
■主要负责自动塑封模设备、后固化烘箱设备、Tirm&Form设备的正常运作,包括日常维护、保养及异常处理,确保产能产出及良率的达成;
■能够独立处理自动塑封模设备、后固化烘箱设备、Tirm&Form设备至少一种机台常见故障,确保产线设备正常运作;
■能够按作业指导书要求,熟练进行产品的转换,并达到生产要求;
■协助操作员做好关键设备日常点检,严格控制设备运行状况质量;
■协助工程师完成封装样品调试及加工;
■能够适应公司的倒班模式,遵守产线工艺和劳动纪律,服从主管调度,共同完成当班生产任务;
任职资格:
■有一定的设备维护保养经验;
■具有团队合作精神,较强的组织、协调和沟通能力。
测试设备技术员
岗位职责:
■主要负责测试设备的正常运作,包括日常维护、保养及异常处理,确保产能产出及良率的达成;
■能够独立应对机械手/测试机/辅助设备的常见故障报警,善于总结与分享;
■能够按作业指导书要求,熟练进行品种切换、规范配置软/硬件;
■协助工程师完成样品调试/试跑等工程考核类验证;
■适应公司的倒班模式,遵守劳动纪律和作业规范,服从主管调度,共同完成当班生产任务;
任职资格:
■有一定的设备维护保养经验;
■具有团队合作精神,较强的组织、协调和沟通能力。
厂务电气维保技术员
岗位职责:
■负责工厂高低压变配电、空压、空調、纯水、废水处理等系统电气稳定,保障工厂生产安全稳定运行;
■负责公司高、低压电气设备的安装监督,负责电气设备的维护保养;
■负责电气维保零部件的预算及采购;
■组织制订各类电气设备维护保养计划并按时执行;
■有工厂电气、空调、空压机、电梯、水泵、消防等维护经验。
任职资格:
■中专以上文凭,电气工程及自动化、机电一体化等专业;
■持有高压电工证,能看懂电路图会电路检修;
■熟悉空调、空压、排风、电梯、消防等系统的工作原理及日常巡检和维护工作;
■4-5年以上维修电工经验;
■有高低压、压力容器、制冷证优先;
■有安全意识,团队合作、交流能力。
工作地:上海/吉林
Location:Shanghai/Jilin
Global External
Manufacturing (GEM)
Main Purpose of the Role:
■Outsourcing of global wafer manufacturing,selection and certification of global wafer manufacturing.
■Management and continuous improvement ofoutsourcing of global wafer manufacturing.
Requirements:
■5 years or above working experience insemiconductor Fab NPI or PIE management industry.
■Be familiar with Outsourcing of global wafermanufacturing.
■Fluent in English reading, writing and speaking.
工作地:欧洲
Location:Europe
Field Application Engineer For
Europe and America
Main Purpose of the Role:
■Drive demand creation activities in mass-market.
■Provide technical support to distributors and sales representatives in Europe and America.
Requirements:
■Have good visibility of design-in and design-win pipeline process.
■Have good technical background in Power electronics applications (Relevant experience in Whitegoods, Industrial, Renewable Energy, Automotive / EV Charger segment is preferred).
■Minimum 2-3 years employment background in electronics and semiconductor industry.
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·申请方式·
领英LinkedIn:
http://www.linkedin.com/company/weensemiconductortrk=nav_account_sub_nav_company_admin
公司官网Company Website:
www.ween-semi.com
邮箱Email Address:
Elaine Zhang elaine.zhang@ween-semi.com
IGBT/SIC/模块厂职位请联系
For IGBT/SIC/Module Plant please contact:
Sabrina Chen Sabrina.chen@ween-semi.com
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