JOINUS瑞能半导体全新岗位出炉，你来不来！

 

·关于瑞能半导体·

作为全球功率半导体行业的佼佼者，瑞能半导体已经走过了逾 50 年的辉煌历程。瑞能始终专注于研发行业领先、广泛且深入的功率半导体产品组合，公司主要产品主要包括碳化硅器件，可控硅整流器和晶闸管，快恢二极管，TVS，ESD，IGBT， 模块等。

产品广泛应用于以家电为代表的消费电子、以通信电源为代表的工业制造、新能源及汽车等领域。瑞能始终以优化客户体验，提升运营效率，强化核心技术为目标，推动全球智能制造行业的向前发展！

愿景VISION

成为全球领先的功率半导体中国供应商。

Become the leading China-based global Power Semiconductor supplier.

使命MISSION

我们通过提供可靠的，创新的和广泛的功率半导体产品组合，并凭借针对应用优化实现的高性价比，使得我们的客户在终端应用中实现最佳效率。

We enable our customers to achieve best-in-class efficiencies in their applications by providing a broad portfolio of highly reliable, cost-effective, and innovative power semiconductor devices.

职位速览

职位速览

工作地：上海

Location：Shanghai

研发工程师 – MOSFET/FRD/ESD

岗位职责:

■跟踪市场的需求并完成MOSFET/FRD/ESD 等芯片和产品的开发；

■参与制定产品的开发计划，负责器件的仿真和版图设计；

■和FAB 讨论确定工艺流程，并制定功率器件流片规划和分组条件；

■参与产品的设计文件的制定，包括工艺规范，封装规范和测试规范等。

任职资格 :

■电子工程，微电子，半导体或者物理等相关专业本科毕业，熟悉半导体制造工艺，具有硕士研究生学历以上者优先；

■具有三年以上产品开发设计经验；熟悉一种以下产品（MOSFET/FRD/ESD）开发流程；

■熟悉半导体封装和测试，了解功率器件的电气参数和动静态参数测试方法。

研发工程师 IGBT

岗位职责:

■参与IGBT 芯片设计开发；

■负责IGBT 芯片的器件仿真，版图设计，流程拟定与优化；

■参与制定并实施产品开发计划，确保开发顺利完成；

■参与IGBT 产品相关设计文件，工艺文件，封装及测试文件的制定；

■晶圆厂，封装厂沟通协调。

任职资格：

■微电子或相关专业硕士及以上研究生，有相关功率半导体开发经验佳；

■掌握TCAD 工具，如Sentaurus，Silvaco，Cadence；

■熟悉Sic器件原理和设计方法；

■熟悉半导体器件制造过程和方法；

■熟悉IGBT 电气参数及测试方法；

■了解DOE，FMEA，FA 相关知识和应用。

应用工程师(Diode or MOSFET)

岗位职责:

■分析客户端相关的应用需求，与产品经理一起参与瑞能新产品的参数与规格的定义；

■跟踪研究相关产品应用的发展趋势，包括通信电源，车载电源，EV charger，光伏逆变器等相关领域；

■为终端客户提供技术支持，并帮助客户解决新产品导入过程遇到的问题；

■为公司销售部同事，代理商和终端客户提供产品产品方面的培训，帮助客户进行更优化的系统级设计。

任职资格：

■本科及以上学历，电气工程，自动化，电力电子与电力传动相关专业；

■3-5年的电源变换设计经验，包括开关电源，消费电子，光伏逆变器，车载DCDC，OBC，UPS等相关领域；

■熟练掌握相关的专业软件工具，包括：Matlab/Simulink, Mathcad, Simplis, Protel, Candence等；

■具备在功率半导体原厂相应应用支持背景的尤佳。

Senior Development Engineer

(Thyristor/FRD/Schottky/TVS/ESD/ MOSFET)

Main Purpose of the Role:

■Development Engineers are responsible for carrying out new product development projects assigned to them by the Product Development Manager, developing and bringing to market new products as required by customers.

■Through a good understanding of semiconductor physics and state-of-the-art technology used in the industry, generate ideas for new projects and improvements to product design.

Requirements:

■Have a good educational and employment background in Electronics and Semiconductor Industry.

■Have good technical knowledge of our Bipolar Products, their design and operating principles as well as how they are used in a typical application.

Senior Development Engineer

(Product engineer)

Key Areas of Accountability:

■Link wafer FAB and Assembly factory, cooperate with package team to finish new product assembly, manage assembly engineering sample build schedule and analysis final test data.

■Maintain the product release process, such as BOM, test spec and yield analysis.

■Electrical characterization of power devices, such as I-V, C-V and double pulse test.

Requirements:

■Education Background: Bachelor’s degree in electrical engineering, Microelectronics, Semiconductor device physics or related area, Master is preferred.

■Minimum 3 years working experience in Semiconductor final test area or new product development.

■Solid knowledge of semiconductor package is preferred.

Application Engineer SIC/IGBT

Key Areas of Accountability:

■Perform various tests of power semiconductor devices such as IGBT, FRD in discrete or module package to quantify their performances.

■Provide technical support to customers, FAEs, and Sales to win the business.

■Design, build, and test demo/evaluation boards.

■Evaluate new products and competition parts in application  environments.

■Perform electrical & thermal simulation to identify product performance.

■Create application notes and technical articles to promote IGBT products.

■Collaborate with design engineers, device engineers, and package  engineers.

■Actively participate in creating new product ideas with other members.

■Train FAEs, Sales, Disty so that they can skillfully promote IGBT products.

Requirements:

■At least Bachelor of Science degree plus relevant experience in power electronics.

■Experience in at least one of the following areas: Solar Inverter, UPS, EV charging pole, motor drive.

■Knowledge in power semiconductor devices.

■Ability to make logical decisions and enjoy solving problems.

■An active team player, and ability to work in a fast-paced team environment

■Ability to travel ~20% of the time.

■Basic English communication skills.

Process Integration Engineer (SIC)

Key Areas of Accountability:

■Responsible for the timely delivery of tasks to allow the completion of projects to the timelines defined in the overall Platform and new product introduction plans.

■Report regularly to relevant stakeholders on progress and results.

■Develop and maintain appropriate levels of expertise in associated areas.

■Provide technical support and expertise on various projects ranging from Platform development to new product introduction.

■Technical input to design rules.

■Lead process development projects.

■The engineer will define his own projects as well as undertake projects assigned to them.

■The engineer will then be responsible for detailed planning of experiment details to investigate and develop new processes and process modules to support current and future platform/product development activities. Execution of these experiments and analysis of their results.

■Progress is reported regularly to the stakeholders in R & D as required. At the end of the project, and at suitable intervals for longer projects, formal written reports to summarize project work should be produced.

Requirements:

■Bachelor or above degree, Electrical or Electronic Engineering/Physics degree (other science degrees might be considered).

■3 years above SiC Semiconductor’s fab experience. Process or Product oriented role in a Wafer Fab for a minimum of 3 years. Familiarity with Discrete Bipolar products would be a distinct advantage.

■Able to design, carry out and analyze process experiments carefully.

■Good English communication skills (reading, speaking, writing).

■Good present skills and team working skills.

■Proven ability to lead successful projects.

Product MarketingManager (IGBT)

Key Areas of Accountability:

■Participate in product definition

Responsible for product portfolio and life cycle management.

■Lead market strategy conception and deployment.

■Drive customer penetration and promotion.

■Mange general market activities.

Requirements:

■At least Bachelor degree of engineering or business.

■Proven market expansion successful experience or rich theory of marketing.

■Insight of power semiconductor market is a plus.

■Strong market sense and high degree of creativity.

■Ability to make logical and fast decisions to capture the dynamic opportunity in the complicated business environment.

■Excellent written, verbal communication and presentation skills.

■Ability to travel ~40% of the time.

工作地：上海金山

Location：Shanghai Jinshan

贴片工艺工程师

岗位职责:

■负责公司功率封装产线的工艺建立及完善；确保产品品质良率及生产效率；

■负责实施新产品工艺开发、新产品的导入、试产的现场指导；

■负责改善生产工艺、建议改善产品性能及结构，持续改进产品性能；

■负责制成品质异常资料分析与改善，提高良率；

■确保过程控制没有漏洞，并实施零ppm 概念；

■撰写并确保工程报告、作业指导书、OCAP 程序、工艺参数、工装图纸在每个阶段都得到审核，并上传至数据库，在产品正式生产前最终确定；

■新材料和新设备的导入和验证；

■功率产品封装工艺建立与改善；

■撰写并制定各关键工序的工艺制程文件；

■通过制程的改善来减少产品的不良品，提高生产良率；

■针对低良拟定专案以及开展改善活动。

任职资格：

■3年以上功率产品封装前道工艺相关工作经验；

■精通solder die attach，reflow oven，solder printing，SMT 等关键工序的工艺流程；

■熟悉PDCA，SPC和FMEA 等质量工具来分析问题；

■能设计和运行DOE 来描述工艺窗口；

■有良好的统计分析和决策能力；

■工作态度积极，自我激励，心胸开阔，能在高压力下工作。

AI WB铝线焊线工艺工程师

岗位职责:

■负责实施新产品工艺开发、新产品的导入、试产的现场指导；

■负责改善生产工艺、建议改善产品性能及结构，持续改进产品性能；

■负责制成品质异常资料分析与改善，提高良率；

■确保过程控制没有漏洞，并实施零ppm 概念；

■撰写并确保工程报告、作业指导书、OCAP 程序、工艺参数、工装图纸在每个阶段都得到审核，并上传至数据库，在产品正式生产前最终确定；

■新材料和新设备的导入和验证；

■功率产品封装工艺建立与改善；

■撰写并制定各关键工序的工艺制程文件；

■通过制程的改善来减少产品的不良品，提高生产良率；

■针对低良拟定专案以及开展改善活动；

■具备铝线WB 和插针等关键工序的工艺技能；

■了解产品在各站点的制程要求以及各站点的设备能力；

■团队管理及协调能力/封装良率/专案项目制定，实施，检验，推广；

■工艺试验及完成率/工艺文件出错损失/制程改进成本降低；

■通过制程改善，降低标准工时，减少人力成本。

任职资格：

■大专及以上学历，电子及机械相关专业；

■3年以上功率产品封装前道工艺相关工作经验；

■精通铝线WB/模块插针等关键工序的工艺流程；

■熟悉PDCA，SPC和FMEA 等质量工具来分析问题；

■能设计和运行DOE 来描述工艺窗口；

■有良好的统计分析和决策能力；

■工作态度积极，自我激励，心胸开阔，能在高压力下工作。

Molding塑封工艺工程师

岗位职责:

■负责实施新产品工艺开发、新产品的导入、试产的现场指导；

■负责改善生产工艺、建议改善产品性能及结构，持续改进产品性能；

■负责制成品质异常资料分析与改善，提高良率；

■确保过程控制没有漏洞，并实施零ppm 概念；

■撰写并确保工程报告、作业指导书、OCAP 程序、工艺参数、工装图纸在每个阶段都得到审核，并上传至数据库，在产品正式生产前最终确定；

■新材料和新设备的导入和验证；

■功率产品封装工艺建立与改善；

■撰写并制定各关键工序的工艺制程文件；

■通过制程的改善来减少产品的不良品，提高生产良率；

■针对低良拟定专案以及开展改善活动；

■具备铝线WB 和插针等关键工序的工艺技能；

■了解产品在各站点的制程要求以及各站点的设备能力；

■团队管理及协调能力/封装良率/专案项目制定，实施，检验，推广；

■工艺试验及完成率/工艺文件出错损失/制程改进成本降低；

■通过制程改善，降低标准工时，减少人力成本。

任职资格：

■大专及以上学历，电子及机械相关专业；

▫3年以上功率产品封装前道工艺相关工作经验；

■精通Mold，Trim/Form，Plating 等关键工序的工艺流程；

■熟悉PDCA，SPC和FMEA 等质量工具来分析问题；

■能设计和运行DOE 来描述工艺窗口；

■有良好的统计分析和决策能力；

■工作态度积极，自我激励，心胸开阔，能在高压力下工作。

(电工)厂务电气维保技术员

岗位职责:

■负责工厂高低压变配电、空压、空調、纯水、废水处理等系统电气稳定，保障工厂生产安全稳定运行;

■负责公司高、低压电气设备的安装监督，负责电气设备的维护保养;

■负责电气维保零部件的预算及采购;

■组织制订各类电气设备维护保养计划并按时执行；

■有工厂电气、空调、空压机、电梯、水泵、消防等维护经验。

任职资格：

■中专以上文凭，电气工程及自动化、机电一体化等专业;

■持有高压电工证，能看懂电路图会电路检修；

■熟悉空调、空压、排风、电梯、消防等系统的工作原理及日常巡检和维护工作；

■4-5年以上维修电工经验;

■有高低压、压力容器、制冷证优先;

■有安全意识，团队合作、交流能力。

工作地：上海/吉林

Location：Shanghai/Jilin

Global External

Manufacturing (GEM)

Main Purpose of the Role:

■Outsourcing of global wafer manufacturing,selection and certification of global wafer manufacturing.

■Management and continuous improvement ofoutsourcing of global wafer manufacturing.

Requirements:

■5 years or above working experience insemiconductor Fab NPI or PIE management industry.

■Be familiar with Outsourcing of global wafermanufacturing.

■Fluent in English reading, writing and speaking.

工作地：欧洲

Location：Europe

Field Application Engineer For

Europe and America

Main Purpose of the Role:

■Drive demand creation activities in mass-market.

■Provide technical support to distributors and sales representatives in Europe and America.

Requirements:

■Have good visibility of design-in and design-win pipeline process.

■Have good technical background in Power electronics applications (Relevant experience in Whitegoods, Industrial, Renewable Energy, Automotive / EV Charger segment is preferred).

■Minimum 2-3 years employment background in electronics and semiconductor industry.

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·申请方式·

领英LinkedIn：

http://www.linkedin.com/company/weensemiconductortrk=nav_account_sub_nav_company_admin

公司官网Company Website：

www.ween-semi.com

邮箱Email Address：

Elaine Zhang  elaine.zhang@ween-semi.com

IGBT/SIC/模块厂职位请联系

For IGBT/SIC/Module Plant please contact：

Sabrina Chen  Sabrina.chen@ween-semi.com